Executive Certification in Physical Design and Signoff

BY
iHUB DivyaSampark via Maven Silicon

Designed for engineers, professionals and graduates wanting to specialize in modern ASIC physical design flows.

Mode

Online

Duration

9 Months

Fees

₹ 200000

Inclusive of GST

Quick Facts

particular details
Medium of instructions English
Mode of learning Self study, Virtual Classroom +1 more
Mode of Delivery Video and Text Based

Course overview

The Executive Certification in Physical Design and Signoff course is a meticulously crafted professional training program delivered by iHUB DivyaSampark, IIT Roorkee in collaboration with Maven Silicon, a reputed VLSI training and workforce development organization. Designed for engineers, professionals and graduates wanting to specialize in modern ASIC physical design flows.The Executive Certification in Physical Design and Signoff course combines academic rigor with practical exposure through structured labs, real-world projects, and masterclasses by top faculty and industry experts. 

Over a 9 month duration, participants will gain foundational understanding of VLSI systems, digital logic, Verilog HDL design, CMOS fundamentals, and advanced ASIC Physical Design techniques such as floorplanning, placement, clock tree synthesis, routing, and timing closure. The Executive Certification in Physical Design and Signoff course culminates in preparing participants to manage the full ASIC flow from RTL to GDSII with real-tool experience and verification checks needed for successful tape-outs. 

The highlights

  • 9 months duration
  • Exclusive 2-Day Campus Immersion Experience
  • Official Certification by iHUB DivyaSampark, IIT Roorkee
  • Comprehensive Placement Support
  • Expert faculties

Program offerings

  • Industry experts
  • Real world projects
  • Eda tool access
  • Placement assistance
  • Campus immersion

Course and certificate fees

Fees information
₹ 200,000  (Inclusive of GST)

The fees for the Executive Certification in Physical Design and Signoff course is : 

Fees components

Amount

Course fees

Rs. 2,00,000 + GST

certificate availability

Yes

certificate providing authority

iHUB DivyaSampark

Who it is for

The target audience for this includes:

Eligibility criteria

The participants must have secured a minimum of 60% throughout their academic record and hold a BE/BTech degree in EEE, ECE, TE, CSE, IT, or Instrumentation, or a ME/MTech/MS in Electronics or MSc in Electronics from a recognized institution. The participants should have less than two years of work experience at the time of enrollment. To be eligible for placement support, participants must obtain a minimum score of 70% in the Final Placement Test conducted by Maven Silicon. Placement assistance will be provided for a maximum period of six months from the date of the first appearance for the Final Placement Test. Participants must have no more than one year of career gap and no standing backlogs during admission.

What you will learn

Knowledge of python Knowledge of digital tools Knowledge of linux

The participants will build strong fundamentals in VLSI architecture and digital logic before progressing into advanced aspects of ASIC physical design and physical verification. The Executive Certification in Physical Design and Signoff course covers everything from system-level overview of semiconductor design to hands-on hardware description using Verilog HDL, equipping participants with essential skills to translate design intent into manufacturable layouts. They will explore number systems, FSMs, memory design, and logic fundamentals that set the stage for complex RTL exercises and practical lab work. 

The Executive Certification in Physical Design and Signoff course then drives into the heart of physical design learning industry-standard flows for placement, clock tree synthesis (CTS), routing, static timing analysis (STA), and power/timing optimization. Participants also gain proficiency in handling design rule checks (DRC), layout-versus-schematic (LVS) verification, and advanced challenges such as low-power optimization with UPF integration and signal integrity analyses. Combined with scripting skills and version control, this Executive Certification in Physical Design and Signoff course ensures participants are industry-ready to execute complex ASIC projects end-to-end. 

The syllabus

Module I: VLSI SoC Design

  • VLSI Technology Overview
  • Moore’s Law
  • IP, Subsystems, and Chips
  • SoC Architecture
  • SoC Design Process
  • System-Level Design - Hardware & Software
  • Semiconductor Industry Overview

Module II: SoC ASIC Design Flow

  • VLSI Design Flow
  • ASIC Vs FPGA

Module III: Advanced Digital Design

  • Number Systems

  • Logic Gates

  • Designing Combinational Logic Circuits

  • Latches, Flipflops and Flipflop

  • Conversions

  • Registers & Counters

  • Frequency Dividers

  • Finite State Machines

  • Mealy & Moore FSMs

  • Sequential circuits using Finite

  • State Machines

  • Memories and Programmable

  • Logic Devices.

  • Asynchronous Sequential Circuits

Module IV: RISC-V Instruction Set Architecture

  • RISC-V processor overview
  • RISC-V ISA overview
  • RV32I – R Type Instruction
  • RV32I – I Type Instruction
  • RV32I – S & B Type Instructions
  • RV-32I – J & U Type Instructions
  • RV32I – Assembly programs

Module V: Linux Operating System

  • Different types of Operating System
  • Design Features & layers
  • Basic Linux commands
  • Advanced commands
  • Utilities
  •  Vi editor
  •  Networking in Linux
  •  Hands-On Labs

Module VI: Verilog HDL

  • Introduction to Verilog HDL
  •  Introduction to EDA tools
  •  Data Types
  •  Verilog Operators
  •  Advanced Verilog for Verification
  •  Assignments
  •  Synthesis Coding Styles
  •  Finite State Machine
  •  Hands-On Labs

Module VII: CMOS Fundamentals

  • MOSFET
  •  CMOS Fabrication
  •  CMOS Characteristics
  •  CMOS Circuit Design
  •  CMOS Transistor Sizing
  •  Stick Diagrams and Layouts
  •  Non-Ideal Characteristics
  •  Hands-On Labs

Module VIII

  • Verification vs Testing
  • Faults and Types of Testing
  • Levels of Testing
  • Fault Modelling
  • Fault collapsing
  • Introduction to ATPG
  • Fault classes and simulation
  • Scan Insertion and Test compression
  • Hands-On Labs

Module IX: Tool Command Language [ TCL ]

  • Control Flow Statements
  • Procedures
  • Strings
  • Mathematical Operators
  • Lists
  • Arrays
  • Dictionaries
  • Hands-On Labs

Module X: Python

  • Datatypes and Operators
  • Functions and Loops
  • Python OOP
  • Exceptions
  • File IO Operations
  • Sequences and Methods
  • Hands-On Labs

Module XI:

  • Types of Version Control System [VCS]
  • Git - Basic Workflow
  • Git - Various commands
  • Git - Branching & Merging
  • Git - Configuration
  • Hands-On Labs

Module XII: Physical Design - Overview

  • Design Styles
  •  Partitioning
  •  Floorplanning
  •  Placement
  •  Clock Tree Synthesis [ CTS ]
  •  Routing
  •  Static Timing Analysis [ STA ]

Module XIII: Physical Synthesis

  • Libraries and PDK's

  •  Syntesis

Module XIV: Static Timing Analysis [ STA ]

  • Types of Timing Analysis
  • STA in Design Flow
  • Different Timing Parameters
  • Techniques to improve Timing
  • Timing Analysis Procedures
  • Setup & Hold time violations
  • Eliminate Setup & Hold time
  • violations
  • Hands-On Labs

Module XV:

  • Criteria to measure the quality of
  •  Floorplans
  •  Floorplanning Algorithms
  •  Floorplan Steps
  •  Qualifying Floorplan
  •  Types of Floorplan Techniques
  •  Hands-On Labs

Module XVI:

  • Placement Process

  •  Different Tasks in Placement

  •  Goals of Placement

  •  Pre-placement

  •  Timing Optimization Techniques

  •  Qualifying placement

  •  Hands-On Labs

Module XVII:

  • Sanity Checks
  • CTS Preparations
  • High Fan-out Net Synthesis (HFNS)
  • Vs Clock Tree Synthesis
  • Clock Buffer Vs Normal Buffer?
  • CTS Goals
  • Clock Tree Design Rule Constraints
  • Clock Tree Exceptions
  • Labs on Clock Tree Synthesis
  • Hands-On Labs

Module XVIII:

  • Goals of Routing
  •  Routing Constraints
  •  Hands-on labs

Module XIX:

  • Logic Equivalence Checking Flow
  •  Constraints Handling
  •  Equivalence Checking Methodology
  •  Hands-on labs

Module XX:

  • Signal Integrity
  •  Concerns addressed by Signal Integrity
  •  Factors Affecting Signal Integrity
  •  Cross Talk Noise
  •  Cross Talk Delay
  •  Hands-On Labs

Module XXI:

  • Layout Compaction
  •  Features
  •  Design Style Specific Issues
  •  Compaction Algorithms
  •  Hands-On Labs

Module XXII:

  • UPF Fundamentals
  •  Modeling Power Intent
  •  Static Low Power Verification
  •  Dynamic Low Power verification
  •  Advanced UPF-Based Verification
  •  Hands-On Labs

Module XXIII:

  • Design Rule Check [ DRC ]
  •  DRC rules
  •  Layout versus Schematic [ LVS ]
  •  LVS Issues
  •  IR Drop Analysis
  •  Electro Migration [ EM ]
  •  Methods to fix EM
  •  Hands-On Lab

Module XXIV:

  • Introduction to Gen AI
  • Large Language Models
  • Prompt Engineering
  • Model Fine Tuning and Domain-based
  • models for VLSI
  • Gen AI for VLSI
  • ML for EDA

Module XXV:

  • Transition from College to Corporate
  • Interpersonal Skills and
  • Presentation Skills
  • Email Etiquette
  • Resume Writing
  • Mock Interviews: Technical/HR
  • Interview Skills: Group Discussion
  • and HR Round Preparation

Module XXVI: Capstone Project

Admission details

  • Visit the official course URL : https://www.maven-silicon.com/ihub-iit-roorkee-course-physical-design/
  • Submit the application form
  • Then take an interview.

How it helps

Earning this Certification empowers participants with an industry-recognized credential from IIT Roorkee, signaling their expertise and credibility in the semiconductor field. Participants gain deep knowledge of ASIC physical design flows and acquire hands-on experience with real-world EDA toolchains, preparing them for complex design and verification challenges. The certification significantly enhances employability for a variety of semiconductor and VLSI job roles while providing access to dedicated placement support services. The participants graduate with a strong portfolio built through extensive lab sessions and practical project work, showcasing their applied skills to prospective employers.

FAQs

What is the duration of the participants Executive Certification in Physical Design and Signoff course?

The Executive Certification in Physical Design and Signoff course runs for 9 months with online classes and practical labs.

Is placement support included?

Yes, 100% placement assistance is provided to eligible learners.

What tools will I learn in this Executive Certification in Physical Design and Signoff course?

The participants will work with industry EDA tools for synthesis, place & route, STA, and physical verification.

What careers can I pursue after certification?

Roles include Physical Design Engineer, ASIC Design Engineer, VLSI Design Engineer, among others.

Do I need prior work experience?

No mandatory experience is needed, though a technical background is beneficial.

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