General Overview - history, integration and scaling trends in VLSI.
Enablers of VLSI technology – planar technology, basic characterisation, cleanroom; IC Device Process Integration – doping, patterning process; Planar processing of P-N junction diode.
IC Device Process Integration – CMOS planar processing; Evolution of FET structure and newer device structures.
IC packaging; Support technology - Vacuum systems.
Support technology - Plasma for processing; Crystalline substrates.
Substrates – silicon wafers; silicon-on-insulator (SOI); GaAs and alternate substrates.
Unit Additive Processes – Oxidation and nitridation of silicon.
Unit Additive Processes – Diffusion.
Unit Additive Processes – Ion implantation.
Unit Additive Processes – Thin film process; Introduction to chemical vapour deposition (CVD).
Unit Additive Processes – More on CVD process; physical vapour deposition (PVD).
Unit Patterning Process - photolithography; Unit Subtractive Processes – Etching (cleaning, wet and dry); Statistical Tools - statistical process control (SPC) and design of experiment (DOE); Conclusion Lecture. Supplementary lecture on printing process for thin films.